Feb 22 - Sunday Shopping Watch
Best Sunday Deals - See our Best
Sunday Ad Deals Table below for specific system prices.
Weekly Comparison. Not a weekend of big sales.
They are still some good desktop deals, but laptops have returned
to regular prices.
This Sunday's Special Discounts and Financing.
In addition to sales on specific items, the following store-wide
sales are advertised this week. (Note
that these ads are for the Dayton, Ohio area. Prices or offerings
may be different where you live.)
Best Buy is offering 24 month no-interest financing on all
Pentium 4s with Hyper Threading Technology desktop packages. They
are also offering 12 month no-interest financing on all other
desktop packages and laptops, and $150 mail-in rebate on advertised
laptops and desktop packages.
Circuit City is offering
12 months no interest financing, and up to $150 mail-in rebates,
on advertised desktop packages and notebooks.
Office
Depot
has rebates on advertised PCs.
CompUSA has no store-wide
promotions this Sunday.
Staples has no store-wide promotions
this Sunday.
Compare
to Online Prices - Compare the Sunday ad prices
to those being offered at DealTime, it searches over 160 online
computer stores.
InfoHQ Related Shopping Pages
Shopping
Alerts - Our latest shopping advisories on buying digital
cameras and camcorders, desktop computers, laptops, and other
computer items.
Windows
XP Upgrade Guide - All about upgrading to Windows XP.
What You Need to
Know About Dial-up Internet Service Rebates - The pros and
cons of 'free' Internet service deals. Also see our latest InfoHQ
Tech Watch Newsletter; Free
PC and Free Internet Deals.
Definitions. A complete desktop system/package/complete
package is defined as a computer with monitor and printer
or scanner.
A build-to-order system is customized at the retailer
and then ordered from a computer manufacturer. In addition to
the computer's stated price, you still pay sales tax and shipping
charges (if you order direct from the vendor without going through
the chain store, you may not have to pay sales tax and you could
get a better warranty).
Caution about advertised
prices. When reading advertisements, read the fine
print of the ad to make sure you know what is being advertised
and what it cost. For example, many advertisers will show a complete
system with computer, monitor, and printer but advertise a price
for the computer only.
* Prices discussed in this article. We report
prices after rebates and discounts are subtracted.
Items highlighted in Black are good deals.
Items highlighted in Red means prices
have gone up and the system is not a good buy this week.
Items in normal text means prices are about the same as the previous
weeks.
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Best Sunday Ad Deals
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|
Category
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Product Description
|
Price* (see above)
|
Prices up or Down this Week
|
Store
|
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1. Best Celeron Deal
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eMachines 2.7 GHz complete system
with 17" monitor
|
$439
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-
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Best Buy
|
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2. Best Celeron Deal
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Compaq 2.7 GHz complete system with
17" monitor
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$449
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-
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Circuit City
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1. Best Pentium 4 System
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HP 3.0 GHz Pentium 4 complete system
with HT Technology, 15 inch flat panel, and DVD-RW
|
$1269
|
+$20
|
Best Buy
|
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2. Best Pentium 4 System
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Sony 3.2 GHz Pentium 4 Windows Media
Center complete system with HT Technology, 15 inch flat
panel, and DVD-RW
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$1849
|
-
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Best Buy
|
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1. Best AMD Athlon XP System
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Compaq Athlon 2800+ complete system
with 17 inch monitor
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$619
|
-
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Best Buy
|
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2. Best AMD Athlon XP System
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HP Athlon 3000+ complete system with
17 inch monitor and DVD-RW drive
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$719
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-
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Circuit City
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3. Best AMD Athlon XP System
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HP Athlon 3200+ complete system
with 17 inch monitor and DVD-RW
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$849
|
-
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Circuit City
|
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Best AMD Athlon 64 System
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HP Athlon 3200+ complete system
with 17 inch monitor and DVD-RW
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$1089
|
-
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Best Buy
|
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1. Best Low-cost Laptop
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Compaq 2.6 GHz Celeron with DVD/CD-RW
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$899
|
+$150
|
Office Depot
|
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2. Best Low-cost Laptop
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eMachines widescreen Athlon 2500+
with DVD/CD-RW
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$949
|
-
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Best Buy
|
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1. Best High-end Notebook
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Compaq 2.66 GHz Pentium 4 with DVD/-RW
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$1199
|
-
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Circuit City, Office Depot
|
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2. Best High-end Notebook
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HP widescreen 2.8 GHz with DVD/CD-RW
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$1449
|
-
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Best Buy
|
|
3. Best High-end Notebook
|
Gateway widescreen Centrino 1.4
GHz with DVD/CD-RW
|
$1399
|
-
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Office Depot
|
|
|
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Peripherals and Software
|
|
Best Sunday Deal
|
Seagate 160 GB 7200 RPM Hard Drive
with 8 MB buffer
|
$89
(after rebates)
|
-
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Best Buy
|
|
Best Sunday Deal
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BFG Asylum GeForce FX 5700 Ultra
128 MB
|
$149
(after rebates)
|
-
|
Best Buy
|
|
Best Sunday Deal
|
Sony 8X DVD-RW
|
$169
(after rebates)
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-$20
|
Best Buy, Circuit City
|
|
|
Additional Information. For additional technical
information, advice on how to buy a laptop or desktop, and vendor
and manufacturer links, please see our Computer
Buying Advice page.
About Sunday Shopping Watch. Sunday Shopping
Watch appears every Sunday (except some holidays like Easter and
Christmas) in our News and Rumors column. It is a review of local
(Dayton, Ohio) computer chain store advertisements. While we can
not guarantee your local chain store has the same items, this
article can help you make informed buying decisions.
Feb 20 - Intel Outlines How Architectural
Innovation Will Reshape The Information Age. As the world
moves toward digital technology and vast amounts of new digital
data are created, the converged computing and communications industry
will need to make significant changes to the underlying "architecture"
of its products and applications to improve the way people use
data.
In a speech today at the Intel Developer Forum, Intel Senior
Vice President and CTO Pat Gelsinger said computing performance
in the future will be defined by innovative architectural capabilities
in addition to speed, to realize the full potential of digital
technology.
"Our society is creating massive amounts of complex data
as the world continues to go digital, but it doesn't have the
capability to enjoy the full potential of this rich resource,"
said Gelsinger. "There is a critical need for scalable, adaptable
and programmable computing architectures that have the capability
to recognize, mine and synthesize all of this digital data."
For future computers to be more helpful, they will need to excel
at three key abilities: the ability to recognize data patterns
and models of interest to a specific user or application; the
ability to "mine" large amounts of real-world data for
these patterns; and the ability to analyze, or synthesize, large
sets of data. These capabilities require more memory, processing
power, bandwidth and storage, and will drive the need to change
the basic architectural design of computing and communications
devices.
New Architectural Approach for the "Era of Tera"
Gelsinger said Intel is enabling the move into the era of tera-scale
computing by developing architectures that will enable computing
and communication devices in the future to do the tasks that only
today's supercomputers are capable of handling.
"As Intel quickly approaches billion-transistor processors,
we are aggressively developing innovative ways to use the added
transistors by applying new architectural approaches that will
ultimately result in much more useful computers." He added
that this will be done through architectures that can scale and
adapt to their computing environments.
Gelsinger described some of the innovations that Intel is currently
developing to make architectures scalable, including "helper-threading,"
a technology that increases single-thread performance by intelligently
executing parallel tasks on a single processor as needed. Another
example of the ability to allow architectures to scale in order
handle more and more complex tasks simultaneously is the integration
of multiple processing cores into one processor.
Intel also is researching new technologies that will make these
new architectures more adaptable to multiple environments, applications
and users. For example, Gelsinger described how Intel researchers
are developing a reconfigurable radio architecture for future
chips that will enable devices to communicate over various networks,
whether it be 802.11a, b or g, Bluetooth or other wireless technologies.
Architectural innovations such as these, combined with the continued
increase in clock speed and in the number of transistors packed
on to a single chip, will ultimately determine computing performance
in the future.
For more information on IDF and Intel technology, visit http://developer.intel.com.
Feb 20 - AMD Extends New Class of Servers
and Workstations with Low-Power AMD Opteron Processors. AMD
(NYSE: AMD) today announced an expansion of its awarding-winning
AMD Opteron(TM) processor family, featuring low- and mid-power
products. With the new low-power AMD Opteron processors, enterprise
customers can now employ a common infrastructure based on AMD64
technology at all levels of their enterprise environments -- from
high-performance clusters to blade servers.
The AMD Opteron processors HE (55 watt) and EE (30 watt) for
servers and workstations, which are expected to be available in
March, bring world-class 32-bit performance and easy migration
to 64-bit computing to customers who demand increased compute
density, investment protection for the future and the most performance
per watt of any processor in their class as measured by the industry-standard
benchmark suite SPEC(R) cpu2000.
"Any enterprise concerned about power usage in their data
centers now has a low-power option that also offer industry-leading
per watt performance, reliable security and the assurance of investment
protection," said Marty Seyer, vice president and general
manager of AMD's Microprocessor Business Unit. "The feedback
was clear, with customers asking for AMD64 to take a leadership
role in reducing operational costs through lower power options.
Now enterprise customers have never before had such a broad choice
for power options for both 32-bit and 64-bit solutions. AMD leads
the industry with its AMD64 architecture, and in response to customer
demand, we're pleased to add a broader set of power options."
"As businesses try to squeeze more processing power out
of fixed-sized datacenters and power budgets, performance per
watt is becoming increasingly more important to the enterprise,"
said Vernon Turner of International Data Corporation (IDC). "AMD
answers that need with the low-power AMD Opteron processors HE
and EE, offering some of the most performance per watt of any
processors in their class."
The new low-power AMD Opteron processors are well-suited for
the blade server market. These smaller servers can be less-expensive
to acquire than traditional servers and run cooler than their
full-size counterparts.
The AMD Opteron processor continues to gain wide-ranging acceptance,
with increased endorsements from Fortune 1000 companies, the clustering
and High Performance Computing arena, database computing and workstation
customers who rely on compute-intensive applications like financial
modeling, digital content creation and CAD. A listing of companies
offering AMD Opteron processor-based products can be found at
www.amd.com/serverpartners and www.amd.com/workstationpartners.
Pricing
The AMD Opteron processor models 846 HE and 840 EE are priced
at $1,514 in 1,000-unit quantities. The AMD Opteron processor
models 246 HE and 240 EE are priced at $851 in 1,000-unit quantities.
The AMD Opteron processor models 146 HE and 140 EE are priced
at $733 in 1,000-unit quantities. AMD is immediately taking orders
for the processors, which are expected to ship worldwide within
30 days.
For more AMD news and product information, please visit www.amd.com.
Feb 20 - Toshiba Delivers Performance
Packed Wireless Notebook PC with Double-Digit Battery Life.
Toshiba's Digital Products Division (DPD), today introduced its
next generation lightweight notebook PC, the Tecra M2 -- a stylish
notebook PC designed for corporate and small-to-medium sized business
customers who demand mobility and connectivity without sacrificing
performance.
Weighing as light as five pounds, the Tecra M2 features impressive
battery life -- up to 11.5 hours(a) (with optional extended batteries)
-- in an easy to carry form factor that delivers seamless wireless
connectivity options (IEEE 802.11b, g optional a/g, Bluetooth)
so users can stay in touch, work faster and get more done. Meanwhile,
IT managers will enjoy the Tecra-family benefits of a stable,
configurable notebook with a long product lifecycle.
Packaged in a lightweight, sleek silver chassis, the Tecra M2
features a vivid 14.1-inch XGA (or SXGA+) display and NVIDIA(R)
GeForce(TM) FX Go5200 32MB or 64MB VRAM graphics controller (64MB
VRAM option includes optional Bluetooth capabilities, 10/100/1000
Base-TX Ethernet LAN and IEEE 1394 Firewire port), offering Tecra
M2 customers high-performance graphics for displaying detailed
designs and high-powered presentations in the office, on the road
and everywhere in between.
With options of a high-capacity 12-cell battery and the Slim SelectBay(R)
battery, mobile professionals can enjoy up to 11.5 hours(a) of
battery life maximizing productivity with extended hours of mobile
use.
"We've recognized for the past several years that reducing
the cost and complexity of notebook PC ownership, while increasing
performance and functionality, is critical to IT professionals
and SMB customers," said Taro Hiyama, vice president of marketing,
Toshiba DPD. "Our continued investment in the Tecra brand
-- including advanced wireless connectivity, long battery life
and a lightweight form factor -- reaffirm Toshiba's commitment
to providing high performance notebooks that businesses of all
sizes can appreciate."
Toshiba's Next Generation Tecra: Continuing its Legacy
The Tecra M2 delivers the perfect balance of portability, hardware
and image stability plus high performance. Building on the success
of the Tecra M1, Toshiba's Tecra M2 Series incorporates a new
thin and light design combined with extended battery life, making
it the ultimate road-ready notebook.
The Tecra M2 provides businesses solutions necessary to meet
real business needs. With the Intel(R) Pentium M Processor, up
to 1.70GHz, the sleek Tecra M2 Series is a fully configurable
build-to-order product with various configurations and the perfect
companion for the IT manager looking for a stable, scalable mobile
PC platform. Mobile business customers will also welcome the innovative
design and enhanced productivity features such as high-resolution
displays, high-speed DDR SDRAM memory expandable up to 2GB, DVD-ROM/CD-RW
multi-function drive and up to 80GB hard drives.
Toshiba cna be found online at www.toshiba.com.
Feb 20 - ATI Delivers HDTV Reception
On The PC. Crystal clear HDTV broadcasts can be enjoyed on
the PC with the new HDTV WONDER(TM) announced today by ATI Technologies
Inc. (TSX:ATY, NASDAQ:ATYT).
North American customers will be able to tune in and watch high-definition
television (HDTV) programs on the PC without having to purchase
an expensive TV that could cost more than $2,000. HDTV in North
America offers up to 5.5 times the pixels (dots that comprise
the screen) as standard TV resolution resulting in amazing picture
quality.
In addition to supporting analog NTSC (National Television Standards
Committee) cable, the HDTV WONDER add-in video card allows consumers
to experience the new ATSC (Advanced Television Systems Committee)
digital, free-to-air HDTV broadcasts without having to subscribe
to cable or satellite subscription services.
HDTV WONDER offers the best advanced personal video recorder
(PVR) on the PC today enabling consumers to watch, pause and record
both analog and HDTV programs -- powerful features beyond the
capabilities of most current consumer and PC-based appliances.
Additionally, HDTV WONDER leverages the PC's capabilities by offering
the ability to archive content directly to DVD for personal use.
HDTV WONDER complements ATI's RADEON(TM) line of video cards that
deliver the industry's only full HDTV decoder and display capabilities.
"ATI is simply unrivaled in the analog PC TV space,"
said Godfrey Cheng, Director of Marketing, Multimedia Products,
ATI Technologies Inc. "In 2004, ATI will continue to perfect
our analog technologies and introduce new digital television (DTV)
products such as HDTV WONDER - concrete proof of how ATI's investment
in television and video technologies is coming to fruition. By
leveraging our core DTV technologies and the power of the PC,
ATI has delivered a PC product that has more functionality than
many of today's more expensive consumer electronics devices."
Consumers in the home and office can now receive DTV content
in more places than ever before. Popularly rated TV programs,
such as major league sporting events, soap operas, and prime-time
shows, are all broadcast in HDTV. The National Association of
Broadcasters (www.nab.org) reports there are currently 1,155 DTV
stations on air in 203 markets, serving 99.42 per cent of United
States' TV households.
HDTV WONDER incorporates ATI's own NXT2004(TM) VSB/QAM receiver
designed to receive off-air DTV signals in a wide variety of challenging
terrestrial signal reception environments. NXT2004 integrates
features such as advanced multipath cancellation, tuner control
and all-digital carrier recovery circuitry that eliminates the
need for any other external components. When combined with the
award-winning software application suite, ATI's MULTIMEDIA CENTER,
ATI can deliver a product that will simply revolutionize the PC
and the North American TV market.
Starting this spring, HDTV WONDER will be available as a bundled
purchase with selected ALL-IN-WONDER video cards and separately
on www.ATI.com followed by
broad distribution in retail stores. Additionally, HDTV WONDER
will be offered in Hy-Tek's Tekpanel 300HD and the Tekpanel 370HD
(www.tekpanel.com), wide-screen
all-in-one multimedia computers for home or office. The Hy-Tek
solutions offer state-of-the-art 30-inch diagonal WXGA TFT/LCD,
full-color, wide screen displays to showcase the digital detail
found in HDTV broadcasts.
Feb 20 - Elpida Memory's 1 Gigabyte
DDR2 Small Outline-DIMM Provides Unprecedented Memory Speed.
Elpida Memory, Inc. (Elpida), Japan's leading global supplier
of Dynamic Random Access Memory (DRAM), today announced that it
has shipped the first 1 Gigabyte DDR2 small-outline dual in-line
memory module (SO-DIMM) that brings low-power, high-density, high-performance
and small form-factor benefits to notebook PC applications.
Separately, Elpida has also shipped samples of its 256 Megabit
DDR2 SDRAM device that will be utilized in server and desktop
applications requiring lower density modules. Elpida's extensive
DDR2 product line will be displayed this week at the Intel Developer
Forum, February 17-19, 2004.
"DDR2 is by far the most advanced industry-standard architecture
for main memory applications including notebooks, desktops, workstations
and servers," said Jun Kitano, director of Technical Marketing
at Elpida Memory (USA). "Elpida's new 1 Gigabyte SO-DIMM
extends DDR2 architecture benefits such as high-density, high-speed
performance and low-power consumption to notebook applications.
Our customers can now select the optimum density device or module
for their next-generation processor-based systems."
Elpida's comprehensive DDR2 product portfolio now includes devices
in 256 Megabit, 512 Megabit and 1 Gigabit densities. In addition
to the new 1 Gigabyte SO-DIMM, Elpida also offers unbuffered modules
in 512 Megabyte and 1 Gigabyte densities, and registered modules
in 512 Megabyte, 1 Gigabyte and 2 Gigabyte densities. All modules
are based on 512 Megabit DDR2 SDRAM devices.
For more information, visit www.elpida.com.
Feb 19 - Intel Outlines Platform
Innovations For More Manageable, Balanced And Secure Enterprise
Computing. In their keynotes today at the Intel Developer
Forum, Intel Corporation executives Bill Siu and Mike Fister showed
how a variety of Intel-based computers - from clients to back-end
servers - enable enterprises to best handle the unique computing
requirements for all-sized businesses.
Bill Siu, vice president and general manager, Desktop Platforms
Group, introduced the concept of the "digital office,"
Intel's vision to improve productivity and flexibility in a more
secure and well-managed computing environment. Intel is uniquely
positioned to deliver the platform capabilities and building blocks
to address key corporate computing needs, including collaboration,
mobility, security and manageability.
"The digital office is all about bringing value to businesses
and IT departments by addressing the evolving needs of both,"
said Siu. "Intel is paving the way for corporations to make
IT a strategic asset by bringing products and technologies to
support this vision."
Innovations for the Digital Office
Siu illustrated several cross-platform technologies that Intel
is developing and bringing to market to support its vision of
the digital office. PCs based on the Intel® Pentium® 4
processor supporting Hyper-Threading (HT) Technology, built with
Intel's industry-leading 90-nanometer (nm) process technology
(formerly codenamed Prescott), and the company's next-generation
chipset, codenamed Grantsdale, form the foundation of the digital
office.
HT technology delivers performance benefits targeted at the way
professionals use their PCs, running demanding applications simultaneously.
In the future, HT Technology will be followed by multi-threading
technology, involving new processor designs featuring dual cores
(essentially two processors on a single piece of silicon).
In addition to technology enhancements, new desktop form factors
are also on the horizon. Intel plans to debut "Balanced Technology
Extended," or BTX, as a new desktop form factor specification
that defines motherboard sizes and layouts. BTX will enable PC
designers, for the first time, to use a standard form factor to
fit new, high performance features for the digital office into
aggressively compact systems.
In the areas of secure computing Intel plans to combine HT Technology,
a new technology called "No Execute" (NX) memory protection
and the codenamed LaGrande technology (LT) to enable improved
security. The NX feature, which is already available in Intel®
Itanium® 2 processors for servers, will be available in processors
for clients in the second half of 2004.
Vanderpool Technology (VT), the codename for a set of hardware
enhancements to the processor and chipset that help improve the
resilience and reliability of the platform, is expected to deliver
a more manageable office computing environment. When combined
with the appropriate software, VT enables multiple, independent
software environments (called partitions) inside a single PC.
Balanced Platforms Built on Enhanced Products, Technologies
As Intel integrates new capabilities into its world class silicon
for the client, it must also deliver new technologies to strengthen
the back-end of the digital office infrastructure.
"Balanced servers and workstations utilizing the latest
platform technologies are the key to reliable, stable and high-performing
enterpise solutions," said Mike Fister, senior vice president
and general manager of Intel's Enterprise Platforms Group.
The Itanium 2 processor family enjoyed strong momentum in 2003,
with more than 100,000 processors shipped by more than 50 systems
manufacturers around the world. These systems benefited from more
than 1,000 applications running on multiple production operating
systems. Intel will continue to innovate on its flagship enterprise
architecture with plans to achieve up to double the performance
over the Intel® Xeon™ processor family at platform cost
parity by 2007.
Today, Intel disclosed new Itanium 2 processors optimized for
dual processor systems. In 2004, the company plans to ship Intel
Itanium 2 processors at 1.4 GHz and 1.6 GHz, each with three megabytes
(MB) of cache, followed by processors codenamed "Millington"
next year. The first multi-core Itanium 2 processor for dual processor
servers and workstations, codenamed "Dimona", will follow
after Millington.
The first dual-core Itanium 2 processor, codenamed "Montecito,"
is due in 2005, and will be supported by Intel's third-generation
chipset optimized for the Itanium processor, codenamed "Bayshore."
Bayshore enables a faster front side bus (FSB) and supports PCI
Express and double data-rate (DDR2) memory. Intel also announced
new technologies in Montecito for enhancing cache reliability
and workload performance, codenamed "Pellston" and "Foxton"
technologies, respectively.
Intel also released today the Intel Xeon processor 3.2 GHz with
a larger, two MB cache, delivering better performance than previous
Intel Xeon processors. The next-generation Intel Xeon processor,
"Nocona," is due in the first half of 2004 and will
ship at 3.6 GHz with an 800 MHz FSB and support for DDR2, PCI
Express and 64-bit extensions.
Helping enterprise customers consolidate servers while improving
scalability, Intel also unveiled a new four-way server blade,
the Intel® Server Compute Blade SBX44, based on the Intel
Xeon processor MP and built in collaboration with IBM. And, for
the rapidly growing small business market segment, Intel introduced
the Intel® E7210 chipset, offering enhanced reliability to
entry level, Pentium 4 processor-based servers.
New technologies will continue to drive opportunities in the
enterprise ecosystem, such as fully-buffered DIMM (FBDIMM), DDR2
and PCI Express.
As examples of this industry-driven innovation, Dell Computer
Corporation, HP, Intel and NEC Corporation today announced version
2.0 of the Intelligent Platform Management Interface (IPMI) specification,
to improve server management, enhance security, and help reduce
costs. Also more than a dozen leading companies joined Intel,
Dell and HP in establishing the Memory Implementers Forum, a new
on-line community for companies to share information focused on
advancing key memory technologies such as DDR2 and FB-DIMM.
About IDF
The Intel Developer Forum is the technology industry's premier
event for hardware and software developers. Held worldwide throughout
the year, IDF brings together key industry players to discuss
cutting-edge technology and products for PCs, servers, communications
equipment, and handheld clients. For more information on IDF and
Intel technology, visit http://developer.intel.com.
Feb 19 - Intel Silicon, Platform
Innovations Speed Advances In Mobile Computing. From new audio
and video experiences to closed-lid access to email, Intel Corporation
today showed how the evolving capabilities of mobile computing
are attracting new users and creating new opportunities for developers.
New mobile products, platform innovations and industry enabling
programs are helping to grow both the overall size of the notebook
market segment and the number of notebooks sold as a percentage
of total PC shipments, said Anand Chandrasekher, Intel vice president
and general manager of Intel's Mobile Platforms Group. Speaking
at the Intel Developer Forum, Chandrasekher outlined Intel's plans
to enhance Intel® Centrino™ mobile technology and the
Intel Pentium® M processor. He also highlighted new concept
mobile PCs with features designed to reshape mobile computing
for a wide variety of users.
"In the last year, enterprise customers have repeatedly
told us that a laptop based on Intel Centrino mobile technology
is the best laptop available," said Chandrasekhar. "With
compelling new mobile platform capabilities and the tremendous
industry momentum around Wi-Fi and Intel Centrino mobile technology,
we envision a rise in new and innovative applications for mobile
computing in both the enterprise and the home."
Driving Momentum Through Silicon Innovation
Intel's product roadmap for 2004 will further advance the mobile
computing experience with even higher performance and more wireless
connectivity choices, and by enabling longer battery life in thin
and light designs.
In the second quarter of 2004, Intel plans to introduce a higher-performing
Intel Pentium M processor (code-named "Dothan"), and
in the second half of 2004 Intel plans to update all the elements
of Intel Centrino mobile technology with the "Sonoma"
platform introduction.
Sonoma includes a new Intel Pentium M processor with a faster,
533 MHz front-side bus; a new Wi-Fi component that supports the
802.11a, 802.11b and 802.11g wireless networking standards; and,
a new chipset code-named "Alviso." The chipset will
support third-generation graphics and enable support for devices
and standards such as Direct Media Interface with improved bandwidth,
TV-out, high definition audio, eight USB ports, four-port PCI
Express, and up to 2GB of DDR2 memory. Alviso will also support
Intel High Definition Audio with low power capabilities to reduce
power consumption by allowing the processor to remain in a sleep
state while audio activity is happening.
Mobile PC sales are growing dramatically, with consumer laptop
sales representing the fastest-growing sub-segment, according
to analyst firm IDC. "With the performance enhancements and
new capabilities of Dothan and Sonoma and the growth of retail
system availability, Intel Centrino mobile technology-based mobile
PCs will become the dream consumer notebook," said Chandrasekher.
Reshaping Mobile PCs to Reach New Users
In addition to delivering innovative silicon building blocks,
Intel works closely with its customers and other developers to
help accelerate the development of new and innovative mobile PCs.
The Mobile Platform Vision Guide (MPVG) provides a framework for
developing future notebooks based on Intel Centrino mobile technology,
and Intel's concept mobile PCs serve as early demonstrations of
the MPVG, highlighting innovation opportunities for the PC industry.
The 2004 MPVG featured Intel's first example of Extended Mobile
Access (EMA), which enables closed-lid instant access to e-mail
and other information through a secondary display on the lid of
notebook PCs based on Intel Centrino mobile technology. PC manufacturer
Lenovo (Legend) demonstrated a model of its EMA-capable "Vela"
laptop, and Insyde Software announced software that enables EMA
functions, including allowing the laptop to enter a low-power
mode when the lid is closed, while remaining connected to a wireless
enterprise network.
To demonstrate 2005 mobile platform concepts, Intel has developed
three concept mobile PCs, code-named "Florence." The
12-inch model features EMA functionality and converts from a laptop
to a tablet PC, allowing maximum flexibility to balance office
and mobile demands.
The 15.4-inch model is designed to enhance worker productivity
with fingerprint and smartcard security, built-in array microphones
and camera for collaboration, and EMA functionality.
The 17-inch Mobile Entertainment PC allows users to communicate
and be entertained around the home with a wide-screen display
in a sleek, portable design; a wireless Bluetooth* keyboard; built-in
voice-over-IP handset and remote control; integrated array microphones
and camera; and Intel High Definition Audio for high-quality sound.
Galvanizing the Mobile Industry and Ecosystem
Along with silicon innovation and visionary reshaping of the
mobile PC, Intel also works with the industry to develop new and
better computing specifications and enhance the mobile ecosystem.
Intel and other members of the Standards Panel Working Group (SPWG)
today announced the release of the SPWG 3.0 specification, designed
to help improve the notebook PC display interchangeability and
time to market.
Additionally, Toshiba Matsushita Display Technology Co. announced
the development of the world's first 2.38-watt, 14.1-inch XGA
and 2.7-watt, 14.1-inch SXGA+ display for mobile PCs, helping
to further reduce laptop power consumption and enable longer battery
life.
In support of Intel Centrino mobile technology, Intel is working
with independent software developers to help optimize applications
to run well in both connected and unconnected environments. Intel
has also developed a new "runs great on Intel Centrino mobile
technology" logo to help users identify software designed
specifically for mobility. To participate, software must have
online and offline capabilities and meet certain power management,
performance or connectivity criteria.
To further enhance the end user's wireless experience, Intel
has also expanded its Wireless Verification Program (WVP) to include
support for the 802.11g wireless standard. The WVP now includes
more than 30,000 verified hotspots worldwide.
About IDF
The Intel Developer Forum is the technology industry's premier
event for hardware and software developers. Held worldwide throughout
the year, IDF brings together key industry players to discuss
cutting-edge technology and products for PCs, servers, communications
equipment, and handheld clients. For more information on IDF and
Intel technology, visit http://developer.intel.com.
Feb 19 - Industry Leaders Developing
First High-Speed USB Personal Wireless Interconnect. Focused
on delivering the first high-speed personal wireless interconnect,
Intel Corporation and other technology industry leaders have formed
the Wireless USB Promoter Group. Other members include Agere Systems,
HP, Microsoft Corporation, NEC, Philips Semiconductors and Samsung
Electronics.
Wireless USB personal connectivity will bring the convenience and
mobility of wireless communications to high-speed interconnects for
multimedia consumer electronics, PC peripherals and mobile devices.
The promoter group has already begun defining the Wireless USB specification
with a targeted bandwidth of 480 Mbps that maintains the same usage
and architecture as wired USB as a high-speed host-to-device connection.
This will enable an easy migration path for today's wired USB solutions.
The spec will be based on Ultra-Wideband (UWB) radio efforts by the
MultiBand OFDM Alliance (MBOA) and WiMedia Alliance, both open industry
associations that promote personal-area range wireless connectivity
and interoperability among multimedia devices in a networked environment.
The 480 Mbps initial target bandwidth of Wireless USB is comparable
to the current wired USB 2.0 standard, and will feature wireless high-data
throughput with low power consumption for distances under 10 meters.
The Wireless USB interface will deliver the benefits of high-speed
wireless connectivity, security, ease-of-use and backward compatibility
to customers.
Intel led the formation of the Wireless USB Promoter Group with the
understanding that the USB Implementers Forum (USB-IF) would act as
the trade association for the Wireless USB specification. Intel will
continue to drive this initiative into the marketplace as the first
commercial application to run on top of the Common UWB Radio platform.
A completed Wireless USB spec is expected by year's end.
"The Wireless USB Promoter Group is committed to preserving
the existing USB device and class driver infrastructure and investment,
look-and-feel and ease-of-use of wired USB," said Jeff Ravencraft,
Intel technology strategist and USB-IF chairman. "Wireless USB
will preserve the functionality of wired USB while also unwiring the
cable connection and providing enhanced support for streaming media
CE devices and peripherals."
Added Microsoft Corp.'s Tom Phillips, general manager of Windows
Hardware: "The Wireless USB Promoter Group is at the forefront
of developing wireless USB specifications that will have widespread
benefits for both our customers and the industry. Microsoft is pleased
to be a part of this organization and we look forward to the solutions
wireless USB interfaces will deliver."
The first Wireless USB implementations are expected to be in the
form of discrete silicon that will be introduced in a number of form
factors. These include add-in cards and dongles along with embedded
solutions to support the technology's introduction and subsequent
rapid ramp-up.
Joining the seven promoter group companies as key contributors are
Appairent Technologies, Alereon Inc., STMicroelectronics and Wisair.
Intel, the world's largest chip maker, is also a leading manufacturer
of computer, networking and communications products. Additional information
about Intel is available at www.intel.com.
Feb 19 - More than a Dozen Leading Companies
Establish Memory Implementers Forum. More than a dozen leading
companies, including Dell and HP, have joined Intel Corporation today
in establishing the Memory Implementers Forum, a new on-line community
focused on advancing key memory technologies such as DDRII and Fully
Buffered-DIMM (FB-DIMM). These memory technologies help improve power
efficiency and performance.
The Memory Implementers Forum will serve as a central community for
member companies to share plans, technical documents, marketing collateral
and up-to-date news. A catalog will feature the latest products and
technologies from across the industry as well as contact information
for each member. Any company that develops memory-related products
or systems using memory can join the Memory Implementers Forum at
no cost with the completion of a legal agreement.
"As Moore's Law continues to drive ever-increasing processing
power, the memory subsystem must keep pace with performance enhancements,"
said Pete MacWilliams, Intel Senior Fellow, Desktop Products Group.
"The Memory Implementers Forum creates a community for discussion
of opportunities and challenges across memory technologies. With the
volume ramp of DDRII-enabled platforms in 2004 and the introduction
of FB-DIMM interconnect technology in 2005, the Memory Implementers
Forum is expected to provide a tool for successful memory technology
transitions."
"Advancing standards-based memory technology is critical to
delivering more scalable and balanced performance on Dell systems
deployed in the enterprise," said Darrel Ward, senior manager
of product planning, Dell Product Group. "This industry forum
is an important vehicle to drive better memory technologies for customers,
such as DDR-2 that will ship in Dell's next generation of servers."
"As a leader in technology development, HP is co-sponsoring
the Memory Implementers Forum to help enable smooth transitions to
next generation memory technologies," said Dwight Barron, HP
Fellow, Industry Standards Servers. "We look forward to working
with the industry in deploying DDR2 and future memory technologies
in HP ProLiant* servers and using the Forum as a resource for memory
industry discussion of next generation technology implementations."
The two primary technologies of initial focus in the Forum are DDR2
and FB-DIMM. DDR2 represents the next wave in memory with memory vendors
planning product introductions to support 2004 platforms. Many DDR2
modules from across the industry have already been validated on Intel
architecture client and server platforms.
FB-DIMM is a new memory interconnect technology standard for high-end
memory connections. FB-DIMM transitions the memory channel to a serial
interface and replaces the DIMM register with a memory buffer. FB-DIMM
connections are expected to enable systems to scale the number of
memory channels available to a server system. Implementations of FB-DIMM
enabled DDR2 memory are expected in future Intel architecture-based
platforms.
The companies that have joined the Memory Implementers Forum so far
include ATP Electronics, Buffalo Technology, Corsair Memory Corporation,
Denali Software, Inc., Elpida Memory, Inc., Hynix Semiconductor, Inc.,
IDT Corporation, Infineon Corporation, Kingston Technology, Inc.,
Micron Technology, Inc., Nanya Technology Corporation, Samsung Corporation
and WinTec Industries Inc.
For more information about the Memory Implementers Forum or to join
the Forum, visit www.memforum.org.
Feb 19 - Dell Launches Mobile Gaming Notebook
-- Inspiron XPS. Dell is taking its award-winning Inspiron notebook
line to the next level of performance with the introduction of the
Inspiron™ XPS, its first gaming notebook aimed at enthusiasts.
At a product launch here this evening, Dell told reporters that serious
gamers can expect ultimate performance, a customized XPS look, and
for the first time on a Dell notebook, an onsite upgradeable graphics
option for a future graphics engine update. The product will list
at $2,849.00.
Performance
The Inspiron XPS will include Intel® Pentium 4 (3.4 GHz) or Pentium
4 Extreme Edition (3.4 GHz) processors and the recently launched ATI
MOBILITY™ RADEON™ 9700 with 128MB of memory, giving the
system enough muscle to play today's popular games. The Inspiron XPS
will also feature subwoofer sound, an integrated DVI port, Gigabit
Ethernet1, four USB 2.0 ports, IEEE 1394 and fast hard drives.
Upgradeable Graphics, Dedicated Support
Offered for the first time on Dell notebooks, the Inspiron XPS will
feature a graphics upgrade option for enthusiasts who want to stay
at the top of their game with leading edge technology. And, getting
the graphics card upgrade is easy.
The customer purchases the upgrade, available at a later date, and
a Dell technician will be dispatched to install the graphics card
at the customer's home. The service is based on the customer's schedule
which eliminates the need to send the system back to Dell and experience
unnecessary downtime.
Additionally, Inspiron XPS customers will have dedicated tech support
manned by experienced technicians, oftentimes gamers themselves, who
are knowledgeable and able to troubleshoot, diagnose and handle the
most demanding inquiries. Dell also works with hardware vendors and
game developers so that specific issues can be resolved.
Unique Look
New for Dell, the Inspiron XPS is designed to look distinctly different
than other systems in the line. The notebook will come with one of
three exclusive personalization QuickSnap color kit options that customers
can use to cover the entire back of the product including Cipher (green
and purple), Skullz (black-and-white skull-and-bones) and Plasma (red
and black). In addition, each system will come with an exclusive backpack
designed for the XPS.
"We tasked our Inspiron XPS development team with creating a
notebook that pulled out all of the stops to achieve an ultimate level
of mobile performance," said Gretchen Miller, director, Inspiron
product marketing, Dell. "The result is a product that looks
great and packs a performance punch. The Inspiron XPS is capable of
taking on the requirements demanded by gamers and enthusiasts and
will be supported by some of the best technicians in the industry."
For more information about the Inspiron and Dimension XPS, go to
www.dell4me.com/XPS.
Additional technical information for the Inspiron XPS
Intel® Pentium 4 and Pentium 4 Extreme Edition both at 3.4GHz
512MB to 2GB DDR RAM at 400MHz
UXGA UltraSharp™ Wide Aspect Display (15.4-inch)
ATI MOBILITY™ RADEON™ 9700 128MB
10/100/1000 Ethernet1, integrated 56K2 v.92 capable modem
Optional integrated Wi-Fi (802.11b/g or 802.11a/b/g) and BlueTooth
capability
DVD+RW/+R3
Choice of Hard Drives: 60GB (7200 RPM), 80GB (5400 RPM)
Integrated subwoofer
Ports include four USB 2.0, one S-Video Out, one IEEE 1394 port, and
integrated DVI port
One PC Card slot
96-watt Hour Lithium Ion battery
Optional second hard drive and floppy disk drive
Included choice of 1 QuickSnap™ Color Kit cover
Exclusive XPS backpack
Feb 19 - IBM Perfects New Method for Making
Low Power, High Performance Processors. IBM today announced it
has developed a new method of manufacturing low power, high performance
microprocessors using an industry-first combination of silicon-on-insulator
(SOI), strained silicon and copper wiring technologies.
IBM is putting the technique immediately to work in volume 90 nanometer
production at its 300mm manufacturing facility. The company's award-winning
64-bit PowerPC 970FX microprocessor will be the first chip built using
this trio of IBM technology breakthroughs.
Early PowerPC 970FX chips produced with the new technology deliver
significant power savings, while performing at an equal or higher
clock speed than comparable processors. The company expects to realize
even greater gains in processor efficiency as it ramps production
of the new process technology.
"Our decades-long commitment to pursuing and rapidly implementing
technology breakthroughs like SOI and strained silicon is paving the
way for a new generation of power savvy chips," said Bernard
S. Meyerson, IBM Fellow and chief technologist, IBM Systems and Technology
Group. "With this fusion of IBM-pioneered technologies, customers
no longer have to sacrifice performance to achieve the power savings
they increasingly demand."
Today, chip designers and manufacturers are confronted by conflicting
pursuits of increased processing speed and reduced power consumption.
Typically, in order to achieve one of these goals, chip-makers need
to sacrifice or significantly impair the other -- trading power consumption
for performance (and vice versa). IBM conquered this challenge by
integrating strained silicon and SOI into the same manufacturing process.
This breakthrough speeds the flow of electrons through transistors
to increase performance and provide an insulating layer in the silicon
that isolates transistors to decrease power consumption.
PowerPC Power Tuning
IBM's versatile new PowerPC 970FX microprocessor is designed for
use in a wide array of applications, from desktops to servers to storage
and communications products, which require 64-bit performance and/or
low power consumption from a microprocessor. Apple has announced that
it will use the PowerPC 970FX in its powerful new Xserve G5 1U rack-mount
server.
The 970FX also takes advantage of another new IBM-refined power saving
technique--enabled through sophisticated system-wide tuning and controlling
of processor frequency and voltage--which will be detailed in a presentation
at the International Solid-State Circuit Conference (ISSCC) in San
Francisco on February 16.
The PowerPC 970FX recently garnered the Microprocessor Report Analysts'
Choice Award for Best Desktop Processor, ahead of the Intel Pentium
4 and AMD Athlon 64 FX-51. The award was announced February 5 in San
Jose.
Derived from IBM's award-winning POWER4 dual-core microprocessor,
the PowerPC 970FX provides users with unrivaled 64-bit computing power,
allowing new applications to virtually address an astounding 18 exabytes
(18 billion billion bytes) of memory while also running 32-bit applications
natively to enable continued use of legacy software as they migrate
to 64-bit applications. The design of the 970FX also supports symmetric
multi-processing (SMP), allowing systems to be created that link multiple
processors to work in tandem for additional processing power.
The PowerPC 970FX uses the same underlying IBM POWER architecture
behind families of IBM microprocessors that power products ranging
from consumer electronics to supercomputers.
About IBM
IBM is a recognized innovator in the semiconductor industry, having
been first with advances like more power-efficient copper wiring in
place of aluminum and faster SOI and silicon germanium transistors.
These and other innovations have contributed to IBM's standing as
the number one U.S. patent holder for 11 consecutive years. More information
about IBM semiconductors can be found at: www.ibm.com/chips.
Feb 18 - Intel CEO Kicks
Off Intel Developer Forum. Intel Corporation CEO Craig Barrett
today described how the pervasive use of digital technology and continued
technology advancement are driving the fundamental transformation
of commerce, entertainment and communications worldwide. Speaking
to more than 4,800 technology industry engineers, developers and designers
at the Intel Developer Forum (IDF), Barrett described the changes
taking place and the significant opportunities being created by technology
for organizations and individuals.
"As organizations around the world look to information technology
to increase productivity and performance, we're entering a period
of rapid change driven by investment in new technology," said
Barrett. "The transformation we're seeing with the convergence
of computing and communications, with businesses continuing to embrace
technology, and with the way entertainment is delivered and consumed,
will begin to be applied to areas such as health care, life sciences,
genomics, and new forms of computational innovation. Digital technology
and silicon will be at the center of innovation as new opportunities,
new fields of endeavor and new business models emerge to benefit from
this transformation."
"At the same time, as digital technology becomes more pervasive,
we must avoid making it overly complex for end-users. Intel and the
industry must focus on developing solutions -- not just technical
features -- that meet customer requirements and which can be more
easily implemented at lower cost in enterprises, the digital home
and in wireless communications."
The Intel Itanium® processor family is a notable example of the
company's solutions-oriented approach to enterprise computing. Through
industry collaboration and investments in software support and other
important complementary technologies, the Itanium processor family
is gaining momentum with key customers and improving business productivity.
Intel sold more than 100,000 Itanium processors in 2003 and major
system installations are being deployed at many Fortune 500 companies.
"Acceptance of the Itanium processor in key areas such as the
financial services industry is extremely gratifying," Barrett
said. "More and more firms in a variety of industries are realizing
the performance, reliability, scalability, manageability and other
benefits of Itanium-based platforms."
In other areas of computing, Intel is focused on meeting new opportunities
by developing technologies and platforms for a broad range of customer
needs that go beyond sheer chip speed. Intel has already brought to
market technologies such as HyperThreading (HT) and Intel® Centrino™
mobile technology that provide end-user benefits in addition to better
performance.
The company has also announced plans to bring the benefits of LaGrande
technology (LT) to enhance secure computing; Vanderpool technology
(VT), which would increase system reliability, flexibility and responsiveness;
and other technologies to improve processing of digital media, packet
processing, runtime performance, and data mining and synthesis. In
the future, Intel processors will also incorporate other enhancements
that will benefit the overall platform.
Beginning in the second quarter, Intel will introduce 64-bit memory
extension technology to its IA-32 architecture for server and workstation
processors. The 64-bit extension technology is one of a number of
platform innovations Intel plans to deliver, or already is delivering
to this segment of the market. Others include Intel Hyper-Threading
technology, PCI Express, DDR2 memory support, enhanced power management
and SSE3 instructions.
"Intel has the resources, flexibility, breadth of support and
technical prowess to provide customers with the features they require
for their computing needs," Barrett said. "Offering a broad
lineup of solutions means that when combined with the Itanium processor
family - which is designed specifically for business critical high-end
server, and technical computing market segments -- we can provide
leadership solutions from top to bottom in a variety of 64-and 32-bit
configurations."
Intel is also focusing resources and attention on the transformation
taking place in the home environment. The growing use of digital technology
in the home is creating new opportunities for companies that can provide
value and increased capabilities at lower cost for consumer electronic
devices. Likewise, broadband wireless technology is transforming computing
and communications. Much like Intel's Centrino mobile technology has
changed the way businesses and individuals can now use technology,
next generation cellular technologies along with new communications
standards such as WiMax will further accelerate the convergence of
computing and communications and improve productivity.
"Silicon technology is the engine driving the transformation
of commerce, entertainment, education and science," Barrett said.
"Intel's investments in R&D, manufacturing capacity and worldwide
markets combined with our focus on providing customers a broad range
of solutions, means the opportunities for growth and innovation are
limited only by our own imaginations."
About IDF
The Intel Developer Forum is the technology industry's premier event
for hardware and software developers. Held worldwide throughout the
year, IDF brings together key industry players to discuss cutting-edge
technology and products for PCs, servers, communications equipment,
and handheld clients. For more information on IDF and Intel technology,
visit http://developer.intel.com.
Feb 18 - Dolby And Intel
Launch Dolby PC Entertainment Experience. Dolby Laboratories and
Intel Corporation today announced cooperative efforts to extend the
consumer electronics (CE) sound and entertainment experience to the
PC based on Intel® High Definition (HD) Audio - or Intel®
HD Audio for short. As part of the Dolby PC Entertainment Experience
Initiative, Dolby is launching a new Integrated Audio Codec Licensing
program and a PC Logo Program featuring world-class Dolby Surround
Sound technologies.
The Dolby Integrated Audio Codec Licensing program is designed to
enable PC audio codec companies to develop solutions that work with
Intel HD Audio, Intel's next-generation audio architecture formerly
codenamed "Azalia."
Intel HD Audio enables evolving usage models for today's PC audio
architecture. With the introduction of this new initiative and licensing
program, Dolby is opening a whole new world of PC entertainment capabilities.
A key element of the Dolby PC Entertainment Experience Initiative
being unveiled at Intel Developer Forum (IDF) this week, is the Dolby
PC Logo Program, which will make it easy for consumers to select a
PC with the Dolby audio technologies that best meet their entertainment
needs.
The PC continues to evolve into a digital entertainment platform
from where consumers enjoy music, movies and games with uncompromised
quality at home or on the road. With the Dolby PC Entertainment Experience
Initiative and Intel HD Audio, PC users will have access and control
of Dolby premier technologies as they would with home theater systems.
Using HD Audio codecs that include Dolby premier technologies, PC
manufacturers will be able to offer PCs with integrated system-wide
support for the following Dolby® premier technologies; Dolby Headphone,
Dolby Virtual Speaker, Dolby Digital Live, and Dolby Pro Logic IIx.*
Consumers will have the ability to enjoy a richer and more engaging
experience from any audio source in virtually any listening mode.
Louis Burns, Intel vice president, general manager, Desktop Platforms
Group, demonstrated Intel HD Audio and announced Dolby's new Integrated
Audio Codec Licensing program during his keynote address today at
IDF. Joining him on stage was Steve Vernon, vice president of licensing
technology at Dolby Laboratories.
"Dolby Laboratories is the established leader in consumer electronic
audio technologies and surround sound entertainment," Burns said.
"We're excited about today's announcement as it combines the
power and flexibility of the PC with Dolby's premier sound technologies
to deliver a compelling customer experience for home theater, audio
and gaming applications."
"The Dolby PC Entertainment Experience Initiative will provide
consumers with the freedom to enjoy their entertainment the way they
want to," said Steve Vernon, Dolby vice president of licensing
technology. "Whether you want to listen through two speakers,
a multi-channel home theater set-up or headphones, Dolby technologies
are now accessible seamlessly through your PC."
The Dolby PC Logo Program is designed to make it easy for users to
choose a PC with the appropriate Dolby technologies to meet their
specific entertainment needs. An overview of Dolby's offerings follows:
Dolby Sound Room -- Users can enjoy a personal Dolby surround sound
experience from the very best seat in the house without a complete
5.1 speaker system. Includes Dolby Digital, Dolby Headphone, Dolby
Virtual Speaker and Dolby Pro Logic II technologies.
Dolby Home Theater -- Enjoy a true 5.1 speaker home theater surround
sound experience that places you, your family and friends right in
the middle of movie action; immerses you in music; and gives you the
power to create DVDs with Dolby Digital technology. Includes Dolby
Digital, Dolby Headphone, Dolby Virtual Speaker, Dolby Pro Logic II
and Dolby Digital Stereo Creator.
Dolby Master Studio -- The ultimate set of audio presentation capabilities
designed to bring your entertainment to life and give you the power
to author DVDs with Dolby Digital technology. Amaze family and friends
with 7.1 channels of surround sound - for the most natural and immersive
entertainment experiences possible from DVD movies, music, games or
broadcast television. Or create your own dramatic presentations and
home videos on DVD with true to life Dolby Digital audio. Includes
Dolby Digital, Dolby Digital Live, Dolby Headphone, Dolby Virtual
Speaker, Dolby Pro Logic IIx and Dolby Digital encoding.
For more information about Dolby Laboratories or Dolby technologies,
please visit www.dolby.com. For
more information on IDF and Intel technology, visit http://developer.intel.com.
Feb 18 - Intel Sees Unified Platform And
Ecosystem As Key To Enabling The Digital Home. Delivering a valued
experience for the digital home that keeps consumers connected everywhere
they go will depend on the ability to create a unified platform and
a surrounding ecosystem of support, in addition to specific new consumer-focused
technologies, according to Louis Burns, Intel vice president and general
manager of the Desktop Platforms Group.
Speaking today at the Intel Developer Forum, Burns said the computing,
consumer electronics and communications industries are merging to
become one and that this new converged industry must deliver unified
solutions focused around three consumer imperatives.
"First, we must make the whole experience simple," Burns
said. "Devices have to work right out of the box. They have to
be easy to set up, easy to turn on and off, easy to operate, and easy
to access. Secondly, consumers want all their devices to connect and
communicate wirelessly. Cable clutter and multiple remotes just won't
cut it. Finally, content delivery must be a high-quality audio and
video experience. Consumers want premium quality for their premium
content.
"Our goal must be to provide a complete and satisfying experience
in the digital home that consumers will value and pay for," he
said. Burns also said that the digital home is about much more than
entertainment.
"When we hear the phrase 'digital home,' we automatically think
about entertainment, but the digital home goes way beyond entertainment
and far beyond a home's four walls," he said. "What the
digital home really means is access to your content any time, anywhere
and on any device for entertainment, as well as for learning, personal
productivity and communicating."
Research-Based Technologies for the Digital Home
Intel's investment in research and development during the recent
economic downturn and its commitment to ongoing manufacturing and
process innovation has given the company a strong pipeline of technologies
to enable a unified platform for the digital home. Key among these
new technologies is Intel's new Pentium® 4 processor built on
90nm (formerly Prescott), which is available now, and an upcoming
chipset code-named "Grantsdale," which will be available
in the second quarter of this year.
Developed for the mainstream consumer market segment, Grantsdale
will include next generation integrated graphics optimized for high-definition
video and dual independent display technology that allows independent
images to be delivered to two different displays.
Grantsdale and Alderwood (an enthusiast chipset) will be the first
PC client chipsets to feature DDR2 memory. This technology will provide
higher bandwidth and cooler temperatures for all types of PCs, including
Entertainment PCs and notebooks.
Grantsdale will also feature PCI Express, a new, higher bandwidth
bus technology, and an integrated wireless access point, eliminating
the need for consumers to set up and configure a separate wireless
home network. Intel® High Definition Audio, formerly codenamed
Azalia, will be built into the Pentium 4 Processor, Grantsdale platform
to provide full Dolby 7.1 Surround Sound* for an outstanding home
theater experience. At IDF, Intel and Dolby Laboratories announced
they are working together to extend the CE sound and entertainment
experience to the PC based on Intel High Definition Audio.
Unified Platforms for the Digital Home
In addition to the chipset building blocks, Intel is working with
other industry leaders to develop unified platform designs for the
digital home. An outcome of this collaboration is a platform code-named
"Kessler."
Based on the Pentium 4 processor and Grantsdale running Windows XP
Media Center Edition*, Kessler is an example of an Entertainment PC,
a slim form factor, high-performance PC connected to a television
screen. Entertainment PCs can be used to organize, consume and enjoy
digital content such as music, movies, TV programming, gaming and
high-definition video. The device will be capable of sharing content
wirelessly and operated with a remote control instead of a keyboard.
It will include a built-in TV tuner, DVD player and Personal Video
Recorder (PVR) and be capable of acting as a digital media adapter.
"The Kessler platform simplifies the digital home by integrating
a whole rack of multiple devices into a single unit," Burns said.
The Kessler Consumer Enthusiast platform from Innovation Alliance
member FIC is an example of the industry support for the Entertainment
PC concept. The platform will be available to PC manufacturers through
FIC this year.
A prototype reference design from Intel code-named "Sandow"
features further technology innovations such as "instant on/visually
off" capability and an HDTV PVR. It should be available in 2005.
In addition to developing platforms, Intel is working with hardware,
software and content and service companies to enable the complete
ecosystem required to deliver on the promise of the digital home.
In order to help the industry develop consumer products that work
together better, Intel announced the first building block products
validated for the Intel® Networked Media Product Requirements
(Intel® NMPR). The Intel NMPR-validated middleware solutions available
from BridgeCo, icube, Mediabolic and Oregan Networks, will enable
device manufacturers to deliver interoperable consumer products in
the coming months.
Intel has also been working with content and service companies to
extend their services beyond the PC to other devices around the home.
Intel is developing a digital home content program and guidelines
to help software vendors and content providers so that consumers will
be able to move content between Intel NMPR-connected devices.
Through the $200 million Intel Digital Home Fund, Intel is also investing
in companies developing hardware and software, as well as connectivity
and supporting technologies.
To enable the availability of the premium content for the digital
home, Intel and Movielink today announced they have signed a co-marketing
and technology collaboration agreement designed to accelerate the
deployment of premium online movie content to multiple devices in
the home as well as mobile PCs.
To bring the device and Web services worlds together, Burns announced
that BEA Systems, Canon Inc., Intel and Microsoft Corporation have
published a new Web services specification called WS-Discovery. With
WS-Discovery, the companies are taking an important step toward enabling
a rich and diverse set of devices to become fully integrated with
Web services. Burns said WS-Discovery will operate whenever a device
is connected to a network, leaves a network or is looking to see what
else is on a network.
For more information on IDF and Intel technology, visit http://developer.intel.com.
Feb 18 - Rambus to Demonstrate the World's
Fastest Memory Device at Intel Developer Forum. Rambus Inc. (Nasdaq:RMBS),
a leading provider of chip-to-chip interface products and services,
today announced that it will be showing the first public demonstration
of Toshiba Corporation's 512-megabit XDR(TM) DRAM. The demonstration
will take place in the Rambus booth (#502) at the 2004 Intel Developer
Forum (IDF) being held February 17 - 19, 2004 at the Moscone Center
in San Francisco. Samsung also plans to showcase its XDR DRAM for
the first time at the event. Running at 3.2GHz, XDR DRAM is the world's
fastest memory device, offering eight times the bandwidth of today's
best-in-class main memory.
"Last December, we broke new ground once again when we were
first to begin sampling the world's fastest memory," said Shozo
Saito, Technology Executive of Semiconductor Company at Toshiba Corporation.
"By combining our advanced expertise in trench capacitor cell
technology and high speed DRAM with Rambus's ingenious chip-to-chip
interface technology, we successfully developed this extraordinary
chip, capable of delivering unprecedented multi-gigahertz of data
to power future consumer and graphics devices."
"Providing our customers with XDR DRAMs will allow us to continue
supplying the market with high-quality memory products that provide
exceptional bandwidth capabilities," said Tom Quinn, vice president
of Samsung Semiconductor memory sales and marketing. "We look
forward to ramping XDR DRAM into high-volume production in 2004 and
2005."
XDR DRAMs are based on Rambus's XDR memory interface technology.
Three of the key innovations include:
-- Differential Rambus Signaling Level (DRSL) -- a bi-directional
differential signaling technology offering a high-performance, low-power,
and cost-effective solution for getting bandwidth on and off chip;
-- Octal Data Rate (ODR) -- a technology that enables eight bits
of data to be transferred on each clock edge, four times as many as
today's state-of-the-art double data rate (DDR);
-- FlexPhase -- a circuit architecture that enables precise data
transfer and simplifies system designs.
"This first demonstration of XDR DRAM is a key milestone, bringing
us one step closer to providing XDR DRAM in high volume to the market,"
said Laura Stark, vice president of the Memory Interface Division
at Rambus. "We are pleased that Toshiba and Samsung are in the
process of sampling XDR DRAMs and look forward to their ramp to volume
production later this year and into 2005."
XDR DRAMs are designed for high-performance broadband applications,
including digital consumer electronics, network systems and graphic
systems. These applications process data at very high speeds in real
time, and therefore require ultra high-speed memory chips.
Toshiba recently announced it is the first to begin sampling its 512-megabit
XDR DRAM. In addition to Toshiba, Rambus has licensed its XDR memory
interface technology to Elpida Memory, Inc. and Samsung Electronics
Co., Ltd. These manufacturers expect to ship XDR DRAM later this year
and ramp to volume production in 2005. Additional information on XDR
DRAM and the memory interface can be found at www.rambus.com/xdr.
Feb 18 - Cisco and IBM Unveil New Model
for Business Security. IBM and Cisco(R) are collaborating to address
a widespread issue within businesses -- ineffective and inefficient
security resulting from piecing together multiple, disparate security
products and services. Enterprises and governments realize they need
a more effective way to protect their businesses from increased external
hacker threats, to combat costly viruses and worms, and to control
employee, customer and business partner access to internal data and
applications.
As part of their long-standing strategic alliance, IBM and Cisco
intend to integrate various products to help customers build self-defending
environments that will span critical points of business computing
-- from laptops to corporate data. This automated approach to information
security can help simplify security, reduce implementation and administration
costs, and bolster business productivity. This can also help customers
more rapidly reap the benefits of on demand business.
As a result of this collaboration, systems, applications and networks
can be protected by integrated security technologies from IBM and
Cisco. Key security enforcement points within businesses can now "talk"
to each other and help identify systems that are not compliant with
established security policies, helping to detect when threats are
imminent. When non-compliant systems or threats are detected, the
IBM and Cisco security technologies can automatically adapt to security
breaches and help keep associated remediation costs down.
"As a leading manufacturer of a wide range of semiconductor
components and integrated circuits, National Semiconductor understands
the challenges associated with applying effective end-to-end security
when selecting products from disparate vendors," said Ulrich
Seif, senior vice president and chief information officer for National
Semiconductor. "This alliance of two industry-leading security
companies helps address these security challenges, and it has the
potential to not only dramatically improve security but also reduce
risk and lower costs."
Initially Cisco and IBM will deliver the following:
-- Integrated user provisioning -- New integration between the Cisco
Secure Access Control Server (ACS) and IBM Tivoli(R) Identity Manager
software can help customers reduce the costs of managing a large number
of employee, business partner and customer identities, across a broad
array of n
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