Microsemi Develops 802.11ac WiFi Chip

ALISO VIEJO, Calif., Jan. 10, 2012 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its breakthrough technology platform for 4G RF front-end modules (FEMs) based on silicon germanium (SiGe) technology. The company is already developing next-generation IEEE 802.11ac wireless LAN FEM on this innovative new platform. IEEE 802.11ac is now being referred to as fifth-generation WiFi or 5G WiFi by the industry.

Microsemi’s new platform integrates multiple filters, switches, LNAs and power amplifiers onto a single monolithic SiGe die, and supports multiple input/multiple output (MIMO) functionality. The high level of integration allows substantial reductions in cost and printed circuit board footprint, which are key considerations when designing devices such as smartphones and tablets.

“Microsemi has developed what we believe to be the world’s first silicon germanium-based, single-chip RF front-end module platform capable of meeting the stringent requirements of 4G applications while still offering space and cost-savings,” said Darcy Poulin, director of product engineering for Microsemi. “Moving forward, we will continue to innovate solutions that facilitate the growth of new industry standards such as IEEE 802.11ac.”

According to ABI Research, IEEE 802.11ac shipments will increase significantly in 2013 with  802.11ac emerging as the dominant Wi-Fi protocol by 2014. Industry research firm In-Stat estimates that nearly 350 million routers, client devices and attached modems with 802.11ac will ship annually by 2015, up from about 1 million units in 2012.

Visit www.microsemi.com for information on its RF IC portfolio.

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